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YUASA Electrolytic Diaphragm For Plating

ユアサ めっき用電解隔膜

The electrolytic diaphragm controls the consumption of additives and enhances plating performance.

Features

  • Being microporous, the neutral membrane involves low electric resistance and smaller movements of liquid.
  • Highly resistant to chemicals.
  • It can be handled easily because it can be kept in dry conditions before use.
  • It can be processed in many different forms such as slit, bag and frame welding.
  • Less expensive than ion exchange membranes.

Applications

  • Diaphragm for copper plating (especially effective in printed circuit boards necessitating fine controls, such as via filling and through hole)
  • Diaphragm for nickel plating
  • All applications of electric plating

Specifications

Model Material Thickness*1
(mm)
Electricity resistance*2
(Ω・dm2)
Membrane polarity Water permeability
(sec/ml/13.8cm2
at 50.7kPa、25℃)
Storage
Membrane Base
Y-9201T Polyvinylidene fluoride
Titanium oxide
Polyethylene
Terephthalate
0.12
±0.03
≦0.0060 Neutral ≧30 Can be stored in dry conditions
Y-9205TA Polyvinylidene fluoride
Titanium oxide, Sucrose fatty acid ester
0.22
±0.03
≦0.0060 ≧10

*1 micrometer
*2 Fall-of-potential method (d=1.200 H2SO4 25℃)
The information shown above are representative values and are not guaranteed.

Effects of the diaphragm

Effects of the diaphragm

Comparison of cost for additive (examples)

Comparison of cost for additive
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Product information

Wide application of Yuasa Membrane System’s products